Hell's Kitchen Season 6 (Full Uncut) DVD x264 XVID X264-MT DVD5.1.The present invention relates to a semiconductor device, a method for fabricating the same, and a method for fabricating a semiconductor device which, for example, forms a light-emitting device (LED) including an LED and a transparent resin package (package) in which the LED is encapsulated.
Conventionally, a chip for an LED such as a laser diode (LD) and an LED for an optical communication is hermetically encapsulated in a package so as to protect the chip from the outside environment. A package is made of ceramics or resins. Such a package is called an “encapsulated package”. Recently, to protect the chip from the outside environment, a package (package including a cap and a frame) made of an epoxy resin is widely used. In this case, a transparent (or light-transmitting) resin is used for the cap.
An epoxy resin has a light transmittance of about 70%. Therefore, an encapsulated package including an epoxy resin has a low transmittance.
A package using a cap made of a transparent resin has a low transmittance as compared to a package made of a ceramic material. In addition, for an epoxy resin, it is necessary to use the package for a long period. However, the epoxy resin has a lower heat resistance than ceramics. Therefore, if a package is used for a long period, the performance of a semiconductor device may decrease. In addition, in the case of a light-emitting device using an LED as a light source, it is desired that an optical output from the device is increased and a lifetime is long. However, for an encapsulated package using a ceramics or a resin, it is difficult to increase the optical output from the device. In addition, if the encapsulated package is used for a long period, the performance of the device may decrease.
In Patent Document 1, an encapsulated package includes a concave part which houses a device and a supporting part which supports the device housed in the concave part. In this structure, a package including a resin has an increased light transmittance as compared to a ceramic package.
Patent Document 2 discloses a package which includes a light-transmitting resin. This package has a light-transmitting resin in which an ultraviolet-ray 0b46394aab